Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There ...

announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed through ...

This indeed significantly increases the manufacturing cost of 2.5D packaging. However, not all applications require 0.5μm/0.5μm L/S, so ASE came up with FOCoS, which uses fan-out technology’s RDL to ...

The company has a technology leadership in advanced packaging solutions with increasing AI exposure. Amkor is the only OSAT capable of doing a full-turkey solution for 2.5D packaging and is ...

More specifically, it combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for ...

With the increasing performance of semiconductors, chiplets-a technology that packages several semiconductors chips into a single package, as represented by 2.5D packaging-is gaining attention.

Strong growth in PLP market with a 27% CAGR from 2024 to 2030, driven by its cost efficiency and ability to meet both ...