News
7d
Interesting Engineering on MSNUS scientists toy with lasers to cool computer chips, bring down data center costsMaxwell Labs envisions a photonic cold plate, a light-based alternative or complement to existing water and air cooling ...
Since the early 1970s, scientists have been promoting gallium arsenide as a faster, more efficient substrate material than silicon for making integrated-circuit chips. However, the vast majority of ...
The researchers built the device with an electron-blocking layer made of aluminium gallium arsenide phosphide ... the paper Current-Matched III–V/Si Epitaxial Tandem Solar Cells with 25.0% ...
The fab is facilitized for up to 10 epitaxial tools and previously produced 2-inch to 6-inch indium phosphide and gallium arsenide wafers. Located six miles from the University of Illinois at ...
In 2001, Motorola developed a technique that places a spongy layer between gallium arsenide and silicon on the same wafer. Combining these two materials yields a higher-speed product at a lower cost.
The cell incorporates subcells made of aluminum gallium indium phosphide (AlGaInP), aluminum gallium arsenide (AlGaAs ... stress-induced defects on the epitaxial materials.
The fab is facilitized for up to 10 epitaxial tools and previously produced 2-inch to 6-inch indium phosphide and gallium arsenide wafers. Located six miles from the University of Illinois at ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results