Hardware-Aligned and Natively Trainable Sparse Attention” was published by DeepSeek, Peking University and University of Washington. Abstract “Long-context modeling is crucial for next-generation ...

Researchers from the University at Buffalo, Central South University, Shandong Normal University, Sungkyunkwan University, TU ...

A new technical paper titled “Modeling and Simulating Emerging Memory Technologies: A Tutorial” was published by researchers ...

Advancements in combining sensors enabling intelligent, distributed processing and standardized communication of object data.

The contention check evaluates conflicting power switch controls. The software traces the path of the control logic “upstream ...

Just when you thought the pace of change of AI models couldn’t get any faster, it accelerates yet again. In the popular news media, the introduction of DeepSeek in January 2025 created a moment that ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; ...

Signal integrity in chiplets; normalizing AI data; multi-physics definitions; CXL, compression; simulation data management; SMP; vision-enabled devices.

Enhanced Performance: Integrating compression with CXL allows for efficient data movement, reducing system latency and power consumption. This is particularly beneficial for AI and machine learning ...

Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of ...

Linear normalization, which is most common, involves shifting the number axis so the data is balanced around zero, and then ...